Mobilint Collaborates with Lanner to Accelerate Edge AI Innovations
TAIPEI CITY, Taiwan, November 13, 2025 — Mobilint, a prominent player in the AI semiconductor sector, has signed a strategic Memorandum of Understanding (MOU) with Lanner Electronics Inc., a leader in industrial embedded and network computing solutions. This collaboration aims to drive advancements in edge AI technology by jointly developing integrated NPU-system solutions that merge Mobilint’s cutting-edge, energy-efficient NPUs with Lanner’s reliable platforms.
The partnership encompasses not only joint development efforts but also co-selling initiatives and bundled offerings targeting global clients. By enhancing the deployment and commercialization of edge AI systems, these solutions are set to impact various industries, including manufacturing, smart cities, security, and robotics.
Key highlights of the partnership include:
– Development of integrated solutions that leverage Mobilint’s advanced NPUs and Lanner’s established systems.
– Aiming to boost the global uptake of high-performance edge AI technologies.
– Lanner’s established reputation for durable industrial platforms in network security and edge computing will enhance AI system reliability.
Seongmo Kim, Head of Business Development at Mobilint, stated, “Combining Lanner’s robust platform capabilities with our proprietary AI semiconductor technology enables us to respond swiftly to market demands.” Meanwhile, Tom Fong, VP of Sales & Global Alliances at Lanner, noted the collaboration would unlock new opportunities and optimize AI system solutions for their customers.
With the joint commitment to pushing the boundaries of edge AI applications, both companies anticipate significant growth potential in various industrial landscapes.
